This is a feature request I think it would be very helpful and that I think is currently not supported by SMT Assembly. When we order a PCB with SMT Assembly it happens many times we don't request the service to solder all components. The non-soldered components are later soldered manually by us (without the use a of stencil). Such a situation is fine if these components are big enough to be soldered manually. However, several times they are not. Sometimes for example I want a particular MCU that comes in a <span class="colour" style="color:rgb(51, 51, 51)">UFQFPN-48 that is quite hard to solder. One technique to solder these types of components is to add solder paste to the pads, melt it, and then place the component and apply again hot air. An example can be seen</span> [here](https://youtu.be/c_Qt5CtUlqY?t=218)<span class="colour" style="color:rgb(51, 51, 51)">. Although it seems easy, it is difficult to add the correct amount of solder paste. If too much paste is added, it results in pin bridges. </span><br> <br> The feature request is very simple: For those components that we do not want SMT Assembly, we could have the option to add solder paste. This would result that the pads of these components will be added to the stencil and filled with a good quantity of solder paste. Then, when in the oven, the solder paste will be melted and the PCB board shipped with it. When we receive the board we just need to place the component in the correct position and apply hot air.